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Control of wetting agents in electroplating applications - Practical use of tensiometers for electrolyte measurement
In many electroplating processes, surfactants are used to specifically improve the wetting behaviour on the parts, to avoid spray mist or to regulate foam formation. A measure of the surfactant content and therefore an essential process parameter is the dynamic surface tension. In order to adjust and control it, SITA bubble pressure tensiometers have been in use worldwide for many years.

In the online seminar "Control of wetting agents in electroplating applications - Practical use of tensiometers for electrolyte measurement" our application experts André Lohse and Tilo Zachmann introduce the dynamic surface tension and its measurement, explain the different SITA tensiometers and present several examples from electroplating and semiconductor technology.

What has to be considered during the measurement? How are samples to be handled? What do the results mean? With the help of illustrative examples, we will explain how parameters are determined in preliminary tests and how the curves and measured values obtained are interpreted. And of course we give an insight into the software SITA-ProcessLog and SITA-LabSolution.
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